Ferroelectric Memory Company (FMC) is a Dresden-based semiconductor company spun out of research at TU Dresden and NaMLab. It develops non-volatile memory based on ferroelectric hafnium oxide, a thin-film material that is compatible with standard CMOS processes. Its DRAM+ and 3D CACHE+ memory chips combine the speed of DRAM with the persistence of flash, and the company says they deliver more than 100% higher system efficiency and processing speed than established products. The technology targets energy-intensive AI data centres and AI edge applications, where memory is described as a major bottleneck and energy use as a growing constraint. FMC operates as a fabless company, designing its own chips and outsourcing production to foundries, and has said it is collaborating with DRAM manufacturers and advanced logic foundries.

The company's earlier work focused on embedded non-volatile memory (FeFET and FeCAP) for microcontrollers and SoCs in automotive, IoT and edge devices. It received seed funding from High-Tech Gründerfonds in 2017, a Series A led by eCAPITAL in 2018, and a $20M Series B in 2020 led by M Ventures and imec.xpand. In November 2025 it raised a €100M package: €77M of Series C equity led by HV Capital and the DeepTech & Climate Fonds, plus €23M in public funding from the IPCEI ME/CT programme and the European Innovation Council. The company said the capital will accelerate commercialisation of DRAM+ and 3D CACHE+ and expand its global presence in a memory market it values at over €100 billion.

In April 2026 FMC strengthened its leadership team with Dr. Raj Jammy as President of Global Business Units and CTO and Norm Armour as COO. Thomas Rueckes is CEO. Seedtable lists about 58 employees.